The Prochip FF® Foiled Panel from Epic Insulation is a high strength, chipboard based underfloor heating solution combining a 22mm chipboard with a 100-micron aluminium foil facing that is foil faced and can be sliced allowing the foil to be pushed into the groove.

Engineered for structural integrity and optimal thermal efficiency, its ideal to be fitted direct to timber joists for both new build and retrofit projects where a robust, low profile system is required.

The Prochip® Panel is made from a 22m chipboard which provides a strong, stable base. The precision routed channels ensure consistent spacing and even heat distribution.

The 100 micron foil layer acts as a diffuser, distributing warmth evenly across the floor surface for faster response times and improved comfort.

The Prochip® Panel is a dry installation and works with the Epic Insulation thermally efficient overlay board CEMDECK® to keep a low profile of just 28mm above the joist to final floor finish.